Solutions · Electronics / PCBA
SPC, traceability, and quality — unified across every SMT line
Connect solder paste printers, pick-and-place machines, reflow ovens, and AOI/SPI stations into a single digital twin. See defect trends in real time and trace any component lot to every board it touched.
Key Challenges
What keeps electronics manufacturers up at night
Challenge
SPC data trapped in machine silos
Each SMT line, reflow oven, and AOI station generates its own SPC data. Engineers manually export CSVs from three different vendor tools to find a common root cause. By the time they correlate the data, the lot has shipped.
How DFI Solves It
DFI Digital Twin ingests SPC data from all equipment in real time via OPC UA and MQTT. Control charts for solder paste volume, placement offset, and reflow profile are unified in a single dashboard with cross-station correlation.
Challenge
Component traceability gaps
Reel-level lot tracking exists at receiving, but the link between a specific reel, feeder slot, and finished board serial number is broken. Counterfeit or moisture-sensitive components slip through without full genealogy.
How DFI Solves It
DFI tracks the chain from incoming reel scan through feeder assignment, placement verification, and board serialization. A single query returns every board that consumed a specific component lot — across all lines.
Challenge
High defect rates with no visibility into trends
First-pass yield sits at 94% but no one knows whether it is solder paste, placement, or reflow driving the remaining 6%. AOI defect codes are inconsistent across shifts and operators classify rejects differently.
How DFI Solves It
DFI normalizes defect codes from AOI/SPI systems into a unified Pareto. Automated defect classification reduces operator subjectivity. Trend overlays show defect rate vs. paste age, stencil life, and humidity — revealing the actual root cause.
Unified SPC
One dashboard for every process parameter
DFI aggregates SPC data from all equipment vendors into a single view. No more CSV exports.
| Parameter | Source | Unit | UCL | LCL |
|---|---|---|---|---|
| Solder Paste Volume | SPI | mil³ | 10.2 | 7.8 |
| Placement Offset X | Mounter | μm | +25 | -25 |
| Placement Offset Y | Mounter | μm | +25 | -25 |
| Peak Reflow Temp | Oven | °C | 248 | 235 |
| Time Above Liquidus | Oven | sec | 90 | 45 |
| AOI Defect Rate | AOI | DPMO | 500 | — |
Equipment coverage
Connects via OPC UA, MQTT, SECS/GEM, and vendor-specific APIs (Fuji, Yamaha, ASM, Koh Young, CyberOptics, Viscom).
Results from PCBA deployments
2.3%
First-pass yield improvement
40%
Reduction in false AOI rejects
< 30 sec
Time to trace reel to finished board
100%
Component lot genealogy coverage
“We went from 94.1% to 96.4% first-pass yield in 12 weeks. The biggest lever was correlating SPI paste volume with reflow peak temp — DFI showed us the interaction we had been missing.”
Process Engineering Lead, Shenzhen PCBA
Read the full case study →Connect your SMT lines in weeks, not months
Start with one line. See unified SPC and traceability in a 4-week pilot.